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Sic Polishing Consumables Market Size, Share, Growth, and Industry Analysis, By Type (SiC CMP Pads and SiC CMP Slurry), By Application (4 Inch SiC Wafer, 6 Inch SiC Wafer, 8 Inch SiC Wafer) and Regional Forecast to 2033
Region: Global | Format: PDF | Report ID: PMI3407 | SKU ID: 26488587 | Pages: 103 | Published : August, 2025 | Base Year: 2024 | Historical Data: 2020-2023
SIC POLISHING CONSUMABLES MARKET REPORT OVERVIEW
The global Sic Polishing Consumables Market size was USD 0.06 billion in 2025 and the market is projected to touch USD 0.2 billion by 2033, exhibiting a CAGR of 22.1% during the forecast period.
The international market of the SiC (silicon carbide) polishing consumables is currently facing a boom, as the demand in high-performance SiC wafers rises in power electronics, electric vehicles, renewable energy systems, and new 5G networks. It is currently worth around USD 71-100 million in terms of spending in the 2023-24 period but is expected to achieve a phenomenal CAGR of 21-23 percent to reach $274-413 million in spending terms by 2030-31
GLOBAL CRISES IMPACTING SIC POLISHING CONSUMABLES MARKETCOVID-19 IMPACT
Sic Polishing Consumables Industry Had a negative Effect Due to Supply Chain Disruptions during COVID-19 Pandemic
The global COVID-19 pandemic has been unprecedented and staggering, with the market experiencing higher-than-anticipated demand across all regions compared to pre-pandemic levels. The sudden market growth reflected by the rise in CAGR is attributable to market’s growth and demand returning to pre-pandemic levels.
Movement restrictions and lockdowns resulted in temporary suspension of manufacturing facilities especially in the parts of the world where the supply of Chinese raw-material was high. The environmental crackdown in China caused a 18 percent reduction in export of quartz sand, which is the primary raw material in the production of SiC, resulting in price increases and shortage
LATEST TRENDS
Surge in EV & Renewable Energy Applications to Propel Market Growth
Electric vehicles and renewable energy systems are one of the key growth drivers that are gaining speed. SiC materials contribute to power application (inverter, converter), where high quality of the polishing consumable is imperative to the performance and efficiency of the device
SIC POLISHING CONSUMABLES MARKET SEGMENTATION
By Type
Based on type the market can be categorized into SiC CMP Pads and SiC CMP Slurry.
- SiC CMP Pads - Silicon Carbide (SiC) CMP (Chemical Mechanical Planarization) pads As the name implies these are high performance polishing pads which are utilized during the CMP process to planarize smoothing SiC wafers. Such pads are usually prepared out of polyurethane or a composite material that provide an exceptional level of control on the polishing pressure and consistency
- SiC CMP Slurry - SiC CMP slurry is the liquid mixture which can contain abrasive particles and chemical agents which are formulated with the purposes of polishing SiC material.
By Application
Based on application the market can be categorized into 4 Inch SiC Wafer, 6 Inch SiC Wafer, 8 Inch SiC Wafer.
- 4 Inch SiC Wafer - An extremely common application is in research and development, power electronics prototyping, and low-volume manufacturing of high-powered semiconductor components as 4-inch diameter wafer products.
- 6 Inch SiC Wafer - SiC materials are being adopted in electrical power electronics, such as in e-cars (also known as electric vehicles, or EVs), in renewable energy inverters, and in industrial power modules, in 6-inch wafers.
- 8 Inch SiC Wafer.- 8-inch SiC wafers is the future of the high-volume semiconductor manufacturing trade lies in the 8-inch SiC wafers, deployed by next-generation EV platforms, smart grid networks, and applications in high-frequency, and high-temperature applications.
DRIVING FACTORS
Surging Demand for Advanced Semiconductor Devices to Drive Market Advancement
One of the key driving factors in the Sic Polishing Consumables market growth is Surging Demand for Advanced Semiconductor Devices. As the technology around the 5G, AI, IoT, and EV become more popular, the push by the manufacturers to have smaller chips that perform faster and have more power is growing. This has resulted in more and more complicated wafer structures - such as 3D-NAND and GAA transistors - and these structures must be precisely planarized. Specifically, the accomplishment of angstrom surface smoothness and improvements would entail high-performing polishing consumables.
Technological Evolution in CMP Processes to Expand the Market
Advanced CMP solutions (such as chemical-mechanical, plasma-assisted and polishing) are under development to process large wafers, extremely thin materials and difficult materials such as SiC. The improvements in slurry formulations, pad technologies, and AI-based process control are increase rates of removal and decrease defects
RESTRAINING FACTORS
High Cost of SiC Materials and ConsumablesPoses Potential Impediments to Market Growth
Silicon carbide is a high quality material which is hard and has a lot of thermal stability yet; it is very expensive. The manufacture of the SiC wafers as with the polishing consumables of slurries, pads and abrasives are products of intricate manufacturing procedures, compounded by the fact that they are subject to steep quality checks. Such material and operational expenses, in turn, raise the total cost of consumables to the extent that it is not affordable to small and mid-sized manufacturers. This is a cost determinant that limits the growth of the market particularly in the price-sensitive areas or where substitute materials can be used.
OPPORTUNITY
Expansion of Electric Vehicle (EV) Industry to Create Opportunity for the Product in the Market
The emergence of electric automotive has resulted into an increased demand of SiC based power electronics, which is more efficient and smaller in size than the typical silicon modules. SiC wafers need to be highly polished to achieve very smooth and defect free surfaces to be used as EV applications. The trend is contributing to increased sales of slurries, pads and abrasive materials that are exclusive to use on SiC Substrates thus providing new markets to manufacturers and suppliers.
CHALLENGE
Technical Complexity and Precision Requirements Could Be a Potential Challenge for Consumers
As a result of the hardness of the silicon carbide material and brittle properties, polishing silicon carbide wafers must be timely and have millimetre precision. It is technically very difficult to develop consumables capable of providing homogenous surface finishing without any micro-crack or any flaws during the process. Firms should spend heavily on R&D and be close in quality control increasing the costs as well as complexity of operations. This is also a barrier of new entry and allows less innovation and competition in the market.
SIC POLISHING CONSUMABLES MARKET REGIONAL INSIGHTS
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NORTH AMERICA
North America has one of the largest market shares in the SiC Polishing Consumables market due to its developed semiconductor infrastructure and the rising applications of SiC on automobiles and avionics. Technological advantage in the region is enhanced by the presence of major players and research institutions that are driven to carry out innovation in power electronics.
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EUROPE
Europe is not left behind on the SiC Polishing Consumables market, as countries such as Germany and France spend funds on green energy and EVs, as well as industrial electronics. The area concentrates on quality, precise engineering and ecological requirements and promotes the adherence of high technologies such as SiC.
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ASIA
Asia Pacific has emerged as the most dominant region in the Sic Polishing Consumables market share due to a convergence of factors that propel its leadership in this dynamic industry. Asia Pacific has the highest shares in the SiC Polishing Consumables market because of its high involvement in the semiconductor and the electronics manufacturing industry, especially in China, Japan, South Korea, and Taiwan
KEY INDUSTRY PLAYERS
Key Players Transforming the Sic Polishing Consumables Landscape through Innovation and Global Strategy
Key enterprise players are shaping the Sic Polishing Consumables marketplace through strategic innovation and marketplace growth. Major companies in the market of SiC (Silicon Carbide) Polishing Consumables including Fujimi Corporation, 3M and Entegris are concentrating on high precision, low defect consumables to satisfy the expanding needs of the semiconductor and power electronic sectors. Such firms are putting resources on R&D to generate innovative slurry formulas, pads, and polishing agents that enhance the area quality of wafers and yield.
List of Market Players Profiled
- DuPont (France)
- Fujibo Group (Japan)
- Entegris (CMC Materials) (USA)
- Saint-Gobain (France)
- Fujimi Corporation (Japan)
INDUSTRIAL DEVELOPMENT
May 2022: Rhombus Energy Solutions, a technology company in EV charging and power conversion, declared the use of the Wolfspeed technology in SiC to enhance efficiency, power density and accelerated charging speed of its products.
REPORT COVERAGE
The study encompasses a comprehensive SWOT analysis and provides insights into future developments within the market. It examines various factors that contribute to the growth of the market, exploring a wide range of market categories and potential applications that may impact its trajectory in the coming years. The analysis takes into account both current trends and historical turning points, providing a holistic understanding of the market's components and identifying potential areas for growth.
The research report delves into market segmentation, utilizing both qualitative and quantitative research methods to provide a thorough analysis. It also evaluates the impact of financial and strategic perspectives on the market. Furthermore, the report presents national and regional assessments, considering the dominant forces of supply and demand that influence market growth. The competitive landscape is meticulously detailed, including market shares of significant competitors. The report incorporates novel research methodologies and player strategies tailored for the anticipated time frame. Overall, it offers valuable and comprehensive insights into the market dynamics in a formal and easily understandable manner.
Attributes | Details |
---|---|
Historical Year |
2020 - 2023 |
Base Year |
2024 |
Forecast Period |
2025 - 2033 |
Forecast Units |
Revenue in USD Million/Billion |
Report Coverage |
Reports Overview, Covid-19 Impact, Key Findings, Trend, Drivers, Challenges, Competitive Landscape, Industry Developments |
Segments Covered |
Types, Applications, Geographical Regions |
Top Companies |
DuPont , Saint-Gobain, Entegris |
Top Performing Region |
Global |
Regional Scope |
|
Frequently Asked Questions
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What value is Sic Polishing Consumables market expected to touch by 2033?
The Sic Polishing Consumables market is expected to reach USD 0.2 billion by 2033.
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What CAGR is the Sic Polishing Consumables Market expected to exhibit by 2033?
The Sic Polishing Consumables Market is expected to exhibit a CAGR of 22.1% by 2033.
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Which are the driving factors of the Sic Polishing Consumables Market?
Surging Demand for Advanced Semiconductor Devices and Technological Evolution in CMP Processes are some of the driving factors of the market.
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What are the key Sic Polishing Consumables Market segments?
The key market segmentation that you should be aware of, which includes, based on type the Sic Polishing Consumables market is classified as SiC CMP Pads and SiC CMP Slurry. Based on the application, the Sic Polishing Consumables market is classified as 4 Inch SiC Wafer, 6 Inch SiC Wafer, 8 Inch SiC Wafer.
Sic Polishing Consumables Market
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